Our bunching, stranding, and compacting dies are precisely manufactured to assure a well-blended internal profile with polished trumpet entry to guide the wires for consistent surface finish and cable quality with least friction.
We manufacture and supply bunching, stranding, and compacting dies using polycrystalline diamond blanks. The range is between 0.05 and 32.00 mm. Our unique diamond mounting ensures better heat transfer, wear resistance, and prolonged die life with optimum speed.
Mikrotek nano can be used in bunching, stranding, and compacting dies for sizes ranging from 0.750 to 150 mm. Our nano dies give 10X longer life than tungsten carbide.
We also supply bunching, stranding, and compacting dies using tungsten carbide nibs; ranging from 0.200 to 100.00 mm.
Good conductor surface
Low friction on conductor
We maintain a robust stock of raw materials to ensure quick deliveries.